Responsibilities:
-Perform Wire bond sub-module assembly, set-up and calibration in meeting in house specification
-Conduct in house qualification on Wire bonding
-Conduct sample bonding, customer device bonding and commencing of customer buy-off
Requirements:
-Diploma/NTC/ITE in Electrical, Electronics, Mechatronic
-Able to work shift
-Able to work in Yishun Ave 7
-Training provided
-Allowances provided: Attendance allowance, Shift allowance, Transport allowance
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